Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems)
Description: Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems) Muhannad S. Bakir is available to download Today’s microchips have nearly reached their performance Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects .This material is available do download at niSearch on Muhannad S. Bakir's eBooks, .Integrated Interconnect Technologies for ... Textbook ....
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